Thermal Mechanical Engineer

Responsibilities

• Develop detailed FEA/CFD models of components, packages, and system-level assemblies using ANSYS or COMSOL
• Correlate FEA results with experimental measurements and prototype test data
• Perform warpage and deformation analysis for multi-material assemblies
• Develop thermal cycling and mechanical fatigue models to predict long-term reliability
• Identify mechanical risk drivers and recommend design or material changes
• Analyze failures related to electro-optical assembly design and provide solutions
• Develop end-to-end simulation workflows to automate processes
• Document and communicate results through technical reports and design reviews

Requirements

• M.Sc. or Ph.D. in Mechanical Engineering, Electrical Engineering, Physics, or related field
• 5+ years of hands-on modeling and simulation experience in the semiconductor industry
• Strong understanding of thermal conduction and convective heat transfer
• Deep knowledge of solid mechanics, including stress, strain, fatigue, and creep
• Proficiency with simulation tools such as ANSYS (Mechanical, Icepak, Fluent) or COMSOL
• Working knowledge of lab-scale validation techniques

Preferred Qualifications

• Experience with Ansys AEDT and Ansys Sherlock
• Understanding of advanced semiconductor packaging and solder joints
• Knowledge of optical system and component specifications
• Exposure to SOC thermal mechanical analysis and optical structural analysis

About the Company

PsiQuantum's mission is to build the first useful quantum computers—machines capable of delivering the breakthroughs the field has long promised. Our architecture is based on silicon photonics, leveraging advanced semiconductor manufacturing to scale quantum systems.