Test and Integration Manager

Responsibilities

• Lead system integration and test engineering teams across the product lifecycle.
• Develop and execute system verification and validation (V&V) strategies.
• Manage hardware, software, and subsystem integration activities.
• Oversee the development of test plans, procedures, qualification protocols, and environmental testing.
• Act as a liaison between Manufacturing Operations and Engineering for troubleshooting and anomaly resolution.
• Drive root cause analysis and corrective actions for integration and test failures.
• Manage project schedules, staffing, budgets, and resource planning.
• Coordinate with Program Management, Hardware Engineering, Quality, and Supply Chain teams.

Requirements

• Bachelor's degree in Electrical, Systems, or Computer Engineering (or a related technical discipline).
• 8–10+ years of experience in system integration and electronics testing.
• 3–5+ years of experience in people leadership.
• Proven experience with hardware integration, debug, and failure analysis.
• Strong knowledge of requirements traceability and configuration management.
• Experience with automated test environments and electronic subsystems.

Preferred Qualifications

• Background in aerospace or defense electronics.
• Experience with MIL-STD qualification testing and environmental testing.
• Experience working within AS9100 environments and with high-reliability systems.
• Familiarity with system architecture, data acquisition, and lab instrumentation.

Benefits

• Paid Time Off
• 401K with Employer Match and Profit Sharing
• Health and Wellness Benefits
• Learning and Development Opportunities
• Employee Stock Purchase Plan
• Competitive Pay and Recognition Programs

About the Company

Curtiss-Wright is an integrated, market-facing global diversified industrial company and a technology leader in advanced technologies for high-performance platforms. Our Defense Solutions facility in Santa Clarita, California, serves as a center of excellence for hardware-level system integration and advanced package design.