Technologist, Packaging Engineering

Responsibilities

• Serve as the senior Package Engineering representative on cross‑functional leadership teams
• Provide end‑to‑end ownership of the package lifecycle across design, development, qualification, and manufacturing
• Lead global engagement with factories and contract manufacturers for high‑volume introduction
• Partner with Packaging R&D organizations to define and qualify next‑generation technologies
• Drive enterprise‑level assembly yield improvement and package cost‑reduction programs
• Own package technology roadmaps and oversee budgets for supported products
• Lead new products through the transition from low‑volume to high‑volume manufacturing
• Provide technical leadership in evaluating design options through DFX analyses including DFM, DFA, and DFRW

Requirements

• Master’s degree or PhD in Material Science, Manufacturing, Mechanical Engineering, Computer Science, Physics or other engineering disciplines
• Minimum 10 years of relevant work experience with a Master's degree, or 8+ years of experience with a PhD
• Proficient understanding of SMT, PCBA, solder joint reliability, and packaging materials
• Experience with machine learning and data analytics utilizing AI technologies
• Strong problem-solving skills and expertise in experimental design and statistical analysis

Preferred Qualifications

• Expertise in die attach, wire bonding, wafer thinning, and molding processes
• Experience mentoring or managing junior engineers
• Knowledge of thermo-mechanical aspects of semiconductor packages and Solid-State Drives

About the Company

Sandisk understands how people and businesses consume data and relentlessly innovates to deliver solutions that enable today’s needs and tomorrow’s next big ideas through advanced memory technologies.