Technical Director, Advanced Packaging

Responsibilities

• Manage the Samsung account globally regarding technology issues and customer service for all ASM products and services
• Build and maintain strong technical relationships with customer R&D, manufacturing, and purchasing stakeholders
• Align ASM product strengths and competitive insights with the customer's advanced packaging roadmap
• Lead service, support, and process engineering teams globally to deliver high-performance solutions
• Collaborate with cross-functional teams including Product Marketing, Product Development, and Service Engineering
• Drive continuous improvement of the customer experience through process and support tool development
• Anticipate future advanced packaging needs to foster long-term innovation and partnership

Requirements

• 15+ years of experience in semiconductor capital equipment
• Deep expertise in Deposition systems (advanced packaging development experience is a plus)
• Strong knowledge of Thin film and Diffusion deposition systems
• Master's degree in Engineering or above (PhD preferred)
• Fluency in English with excellent internal and external communication skills
• Proven ability to manage complex technical relationships and drive strategic business results

Preferred Qualifications

• Previous experience working with the Samsung Process Development Team
• Strong business acumen and strategic thinking capabilities
• Experience in a matrixed organizational environment

About the Company

ASM is a global leader in semiconductor manufacturing technology. For over 55 years, we have been at the forefront of innovation, providing cutting-edge solutions that enable the advanced semiconductor devices driving trends in 5G, cloud computing, AI, and autonomous driving.