Systems IC Architect

Responsibilities

• Own System IC Architecture to define product concepts and specifications for power semiconductor modules and System-in-Package (SiP) solutions
• Develop and maintain long-term product and technology roadmaps in collaboration with product line leaders and R&D teams
• Translate customer requirements into innovative packaging and power management solutions
• Lead the integration of ICs and power semiconductors into advanced packages and systems
• Drive early-phase engineering and architecture for AI compute, automotive 48V systems, and electrification platforms
• Provide strategic insights on state-of-the-art power management technologies and benchmark readiness
• Report KPIs and project status to executive stakeholders

Requirements

• Master's or Ph.D. in Power Electronics, Electrical Engineering, or a related field
• 15+ years of experience in power semiconductors, packaging, and system-level integration
• Deep expertise in System-in-Package (SiP) integration
• Proficiency in circuit simulation tools such as Cadence Spectre, PSPICE, HSPICE, or similar
• Experience with AI compute power solutions or automotive power management

Preferred Qualifications

• Proven track record in product definition through revenue realization
• Strong expertise in thermal management, electrical performance, and advanced reliability
• Experience powering high-performance compute SoC platforms
• Knowledge of functional safety standards such as ISO26262 or IEC61508
• Demonstrated ability to lead cross-functional, global teams

About the Company

NXP enables a smarter, safer, and more sustainable world through innovation. As a world leader in secure connectivity solutions for embedded applications, NXP pushes boundaries in the automotive, industrial & IoT, mobile, and communication infrastructure markets.