Staff Process Engineer, APTD Bonding

Responsibilities

• Develop new or modified process formulations and define equipment requirements and specifications
• Identify, diagnose, and resolve assembly process-related problems using root-cause or model-based problem solving
• Coordinate and complete process, equipment, and material evaluation and optimization initiatives
• Validate and fan out new process baselines, including new processes, tools, and materials for new product introduction
• Support SPC/FDC/RMS/APC and site-to-site portability
• Audit material suppliers to achieve quality, cost, and risk management objectives

Requirements

• BS in Materials Science, Chemical, Electrical, or Mechanical Engineering, Chemistry, or Physics
• 5+ years of relevant industry experience
• Knowledge of Advanced Package Integration and DRAM, NAND, or other memory products
• Experience with Design of Experiments (DOE), Statistical Process Control (SPC), and defect/data analysis
• Experience in semiconductor process engineering and packaging with an understanding of process and equipment interactions

Preferred Qualifications

• MS or PhD in Materials Science, Chemical Engineering, Electrical Engineering, or Mechanical Engineering
• Experience leading project teams and providing leadership updates

Benefits

• Choice of medical, dental, and vision plans
• Income protection programs for illness or injury
• Paid family leave
• Robust paid time-off program and paid holidays

About the Company

Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.