Staff Package Design Engineer

Responsibilities

• Execute package layout design and development for advanced technologies including power modules, FCBGA, SiP, WLCSP, and multi-chip modules.
• Develop and maintain package CAD databases, ensuring adherence to DFM, DFA, and reliability requirements.
• Manage the full package design cycle, including schematic creation, netlist import, footprint assignment, and manufacturing release outputs (Gerber/drill, fabrication drawings, etc.).
• Create and modify substrate and RDL layouts, bump maps, escape routing, and stack-up structures.
• Collaborate with SI/PI, thermal, reliability, and silicon design teams to support package-level co-optimization.
• Ensure designs comply with foundry, OSAT, and substrate vendor design rules (DRC, LVS, and connectivity).

Requirements

• 4+ years of hands-on experience in package CAD layout, substrate design, or advanced package development.
• Strong background in FCBGA, SiP, WLCSP, and multi-die/chiplet-based package architectures.
• High proficiency with industry-standard tools such as Cadence Allegro Package Designer or Siemens Xpedition Substrate Integrator.
• Working understanding of SI/PI fundamentals, high-speed routing, and impedance control.
• Bachelor's or Master's degree in Electrical Engineering, Microelectronics, Materials Science, or a related technical discipline.

Preferred Qualifications

• 6+ or more years of experience in advanced package development.
• Proven experience interfacing directly with Tier-1 OSATs, substrate suppliers, and foundries.
• Experience with power module packaging and advanced substrate-based architectures.

About the Company

Renesas is a global leader in microcontrollers, analog, power, and SoC products, delivering semiconductor solutions that power billions of connected, intelligent devices. We are an embedded semiconductor solution provider driven by our purpose "To Make Our Lives Easier," providing scalable solutions across the automotive, industrial, infrastructure, and IoT industries.