Posted 8 hours ago
Staff Engineer, Packaging Engineering
SandiskStaff Engineer, Packaging Engineering
Requirements
Ph.D. in Mechanical Engineering or M.S. with 2+ years experience, Thermal engineering expertise, CFD/FEA package proficiency, Thermal testing experience
Skills
FEA
About the role
Responsibilities
- Work in the Packaging R&D group on thermal designs across semiconductor packaging, PCBA, and host levels
- Innovate thermal management solutions for high-performance flash products
- Enhance and maintain modeling and simulation infrastructure to improve design and manufacturing efficiency
- Interface with package design, electrical, thermal characterization, reliability testing, and assembly R&D teams
Requirements
- Ph.D. in Mechanical Engineering, or M.S. in Mechanical Engineering with >2 years of industrial experience
- Solid knowledge of thermal engineering through academic or research experience
- Working knowledge of designing and conducting thermal testing
- Proficiency using commercial CFD/FEA packages
Preferred Qualifications
- Knowledge in thermal, structural, or mechanical aspects of package engineering
- Interest in the semiconductor industry
About the Company
Sandisk relentlessly innovates to deliver solutions in Flash and advanced memory technologies that enable the digital world.
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Sandisk · Bengaluru
