Staff Engineer, Packaging Engineering (FIB)

Responsibilities

• Develop and maintain package recipe and process baselines based on FA findings
• Collaborate with fab process, package design, assembly R&D, and characterization teams
• Evaluate package reliability and robustness in response to fab process changes
• Lead package evaluation and qualification for NAND and ASIC technologies
• Support chip structure optimization through detailed FA results and recommendations
• Perform device-level physical failure analysis (PFA) using SEM and FIB techniques
• Conduct FIB cross-sectioning, delayering, and defect localization for root-cause analysis
• Utilize SEM imaging to analyze device structures, interfaces, and failure mechanisms
• Identify and resolve structural and packaging-related reliability issues
• Provide FA insights to influence package and product design decisions

Requirements

• Bachelor’s degree or above in Materials Science, Electrical Engineering, Mechanical Engineering, Physics, or related disciplines
• Strong understanding of device structures, packaging architectures, and failure mechanisms
• More than 3 years hands-on SEM and FIB experience
• Solid experience in physical failure analysis (PFA) of semiconductor devices
• Good English communication skills
• Ability to work effectively in cross-functional, global teams

Preferred Qualifications

• Background in wafer fab processes and device design
• Experience with NAND and/or ASIC technologies
• Familiarity with electrical and physical characterization methods
• Knowledge of assembly processes and advanced semiconductor packaging
• Experience supporting fab or package process change qualification

About the Company

Sandisk understands how people and businesses consume data and we relentlessly innovate to deliver solutions that enable today’s needs and tomorrow’s next big ideas. With a rich history of groundbreaking innovations in Flash and advanced memory technologies, our solutions have become the beating heart of the digital world we’re living in.