Staff Engineer Package Process Development-Wire Bond

Responsibilities

• Perform Wire Bond process development activities, including parameter scouting, optimization, verification, and process freeze
• Establish and set up new assembly process capabilities, including hands-on equipment setup
• Support the build of prototype and development samples
• Manage technical handshakes and knowledge transfer to Operations
• Drive continuous improvement and perform verification/qualification for new tooling, machines, and materials in collaboration with suppliers
• Generate and update technical documentation such as Process Specifications, PFMEA, OJTI, T32, and PDR
• Act as technical lead for task forces and complex problem-solving teams using statistical tools (SPC, APC, DOE, 8D, FMEA)
• Provide technical input for Process of Record, Assembly Design Rules, Failure Catalogues, Control Plans, and Maintenance Checklists

Requirements

• Bachelor or Master’s Degree in Mechanical, Electrical, Electronics, Material Science, Metallurgical Engineering, or a related discipline
• At least 5 years of professional experience in semiconductor packaging
• Strong hands-on knowledge and technical skills in Wire Bond (Al wedge bond) processes
• Proficiency in statistical data analysis and problem-solving methodologies (e.g., DoE, 8D, DMAIC)
• Competent in daily oral and written English for cross-functional and overseas communication
• Strong collaboration, negotiation, and presentation skills

Preferred Qualifications

• Prior experience in Map mold, SON, TO, or DSO power product development

Benefits

• Career development and learning opportunities, including LinkedIn Learning and mentoring programs
• Flexible working arrangements, including flexible hours and mobile work options
• Health and wellbeing programs and community support
• Diverse and inclusive working environment with global employee events

About the Company

Infineon is a global leader in semiconductor solutions for power systems and IoT. We enable game-changing solutions for green and efficient energy, clean and safe mobility, and smart and secure IoT, driving innovation to make life easier, safer, and greener.