Sr. Product Development Engineer

Responsibilities

• Manage CPI-related issues for DRAM memory products from pathfinding through NPI startup into high-volume manufacturing
• Establish package program plans for new DRAM fab technology process nodes specific to DRAM 3DS products
• Coordinate DRAM device, package, and module end-to-end reviews
• Assess risks in Fab BEOL, memory array design, wafer probe flows, and assembly technologies
• Incorporate device design features into CPI and packaging risk assessments
• Correlate electrical failures under various temperature and voltage conditions to CPI physical defects
• Design effective quality and reliability qualification plans using sampling statistics and accelerated stress tests

Requirements

• Master’s degree in Material Science, Chemical Engineering, Metallurgical Engineering, Electrical Engineering, Physics, or a related field
• 60 months of engineering experience in the job offered or an engineering-related occupation
• Deep knowledge of DRAM/NAND memory device structure and function
• Expertise in Chip-package-interaction (CPI), including assembly process stresses and package design influence
• Experience with memory device Wafer Probe and Test flows and electrical data analysis
• Strong understanding of memory device fabrication, specifically memory array and back-end-of-line (BEOL) processes
• Knowledge of CPI quality and reliability degradation mechanisms, including intrinsic vs extrinsic defects

Benefits

• Choice of medical, dental, and vision plans
• Income protection programs for illness or injury
• Paid family leave
• Robust paid time-off program and paid holidays

About the Company

Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.