Sr. Director, Boards, Packages, Reliability

Responsibilities

• Lead and grow global engineering functions including chip package development, board development, and silicon power and reliability.
• Build and mentor high-performing engineering teams distributed across US and Asia sites.
• Drive technical decision-making for advanced package technologies such as 2.5D/3D IC and flip-chip.
• Oversee board-level hardware development from concept through bring-up, ensuring design-for-manufacturability.
• Champion signal integrity (SI) and power integrity (PI) methodologies and EDA tooling adoption.
• Manage complex multi-vendor relationships with OSATs, PCB fabricators, and substrate suppliers.
• Execute cost reduction strategies across packaging, board materials, and test processes.
• Partner with executive leadership to define multi-year roadmaps and organizational strategy.

Requirements

• B.S. in Electrical Engineering, Computer Engineering, or a closely related field.
• 15+ years of progressive experience in semiconductor hardware engineering.
• 5+ years of experience in a senior leadership or director-level role.
• Proven experience managing global, cross-functional teams across US and Asian sites.
• Deep technical expertise in chip package development and substrate design.
• Experience in chip board hardware development, including schematic, layout, and bring-up.
• Proficiency in signal integrity and power integrity analysis tools (e.g., Ansys SIwave, Cadence Sigrity, HyperLynx).
• Solid understanding of silicon design development methodologies.

About the Company

Altera is the world’s largest pure-play FPGA solutions provider. We deliver programmable technologies that help customers innovate and scale across rapidly evolving markets like AI, cloud, networking, and edge. Our end-to-end portfolio includes FPGAs, CPLDs, and System on Modules designed to accelerate innovation globally.