Senior Staff Unit Process Development Die Attach

Responsibilities

• Perform process development activities including parameter scouting, optimization, verification, and process freeze to meet project targets.
• Lead technical handshakes and knowledge transfer to Operations.
• Generate and update critical documentation such as Process Specifications, PFMEA, DFMEA, and Process Development Reports (PDR).
• Support prototype and development sample builds.
• Liaise with suppliers for continuous improvement and qualify new tooling, machines, and materials.
• Act as technical lead for task forces and complex problem-solving teams using statistical tools like SPC, DOE, and 8D.
• Identify and develop new process technologies to meet evolving business requirements.
• Provide technical guidance and mentorship to other engineers and project team members.

Requirements

• Master's or Bachelor's Degree in Engineering or a relevant field.
• 12 years of professional experience within the semiconductor industry or a closely related field.
• Deep hands-on expertise in Die attach technologies (including Cu bumped flip chip, epoxy, glue, and DAF).
• Strong knowledge of mechanical engineering, materials, tooling, and reflow processes.
• Proficiency in statistical data analysis and Design of Experiments (DOE).
• Strong analytical and complex problem-solving skills.

Preferred Qualifications

• Knowledge of fluid and thermo-mechanical simulation.

Benefits

• Career development and learning opportunities including LinkedIn Learning and mentoring programs.
• Flexible working hours and mobile work options.
• Health and wellbeing programs and community support.
• Diverse and inclusive global working environment.

About the Company

Infineon is a global leader in semiconductor solutions for power systems and IoT. We enable game-changing solutions for green and efficient energy, clean and safe mobility, and smart, secure IoT, driving innovation while caring for our people and the planet.