Senior Silicon Substrate & Packaging Manufacturing Engineer

Responsibilities

• Own packaging yield and ramp performance
• Lead manufacturing strategy with OSATs and substrate suppliers
• Define packaging manufacturing readiness criteria from EVT through HVM
• Lead NPI builds (EVT/DVT/PVT) with clear yield and quality targets
• Lead deep root-cause analysis across OSAT and substrate partners
• Establish data-driven monitoring using SPC and Cpk
• Act as the senior technical escalation point for OSAT and substrate vendors
• Own qualification execution and reliability closure
• Define ramp plans and yield maturation curves

Requirements

• 8+ years in semiconductor packaging manufacturing or product engineering
• Proven experience ramping complex FC-BGA or advanced packages to volume
• Deep understanding of flip-chip assembly flows and large body substrate warpage control
• Expertise in underfill and reliability interactions
• Experience with assembly defect pareto analysis and SPC metrics
• Strong track record working directly with Taiwan OSATs and substrate vendors

Preferred Qualifications

• Experience with large AI / HPC ASICs
• Exposure to 2.5D or high-bandwidth memory packaging
• Experience ramping first-generation silicon in a startup environment
• Fluent Mandarin and English

About the Company

Fractile is building silicon, systems and software which will redefine the frontier of AI, running the world’s most advanced models at radically higher speed and lower cost. Founded in 2022, the team is expanding rapidly with a collaborative, problem-solving culture.