Posted 7 hours ago
Senior Principal AI Interconnect Architect
SandiskSenior Principal AI Interconnect Architect
Perks & benefits
Paid LeaveMedical InsuranceMobile AllowanceHealth Insurance
Requirements
Master's or Ph.D. in EE, CE, or CS, 10-15 years experience in interconnect technologies, Knowledge of PCIe, CXL, NVLink, and Ethernet, Experience with fabric topologies, Ability to develop performance models
Skills
PCIeCXL
About the role
Responsibilities
- Develop architectures for chip-to-chip interconnects and switched fabrics tailored for AI/ML scale-out
- Analyze trade-offs in bandwidth, latency, power, area, and reliability
- Participate in industry standard bodies to influence and shape industry specifications
- Work with SoC, package design, and software teams to ensure seamless integration
Requirements
- Master's or Ph.D. in Electrical Engineering, Computer Engineering, or Computer Science
- 10-15 years of experience in interconnect technologies, transport/link level protocols, and switching fabrics
- Familiarity with fabric topologies such as Fat tree, Leaf-Spine (Clos), Torus, and Meshed
- Knowledge of GPU/accelerator clusters and data center infrastructure
- Deep knowledge of PCIe, CXL, NVLink, UALink, Ethernet, Ultra-Ethernet, and serial links
- Ability to develop performance models through modeling and simulation
About the Company
Sandisk understands how people and businesses consume data and relentlessly innovates to deliver solutions that enable today’s needs and tomorrow’s next big ideas through groundbreaking innovations in Flash and advanced memory technologies.
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Sandisk · Milpitas
