Senior Packaging Engineer, Material Engineering

Responsibilities

• Drive advancement in packaging materials by addressing design and process challenges
• Lead evaluation, development, and qualification of advanced packaging materials for product development and high-volume manufacturing
• Perform material characterization, lab testing, and design of experiments (DOE)
• Analyze thermal, mechanical, and environmental performance to ensure reliability
• Interface with package design, reliability, failure analysis, and assembly R&D teams
• Collaborate with suppliers to optimize and qualify materials for production integration

Requirements

• Master’s or PhD in Materials Science or a related engineering field
• Minimum 5 years of experience in semiconductor packaging or materials engineering
• Strong background in material characterization and material mechanics
• Expertise in failure analysis and design of experiments (DOE)
• Deep understanding of packaging materials systems such as polymers, adhesives, laminates, EMC, and substrates
• Familiarity with industry standards and reliability test methods (ASTM, JEDEC)
• Experience working in cross-functional environments

Preferred Qualifications

• Working knowledge of various material testing and characterization instruments
• Understanding of semiconductor packaging processes including molding, wire-bonding, die attach, flip chip, and SMT
• Experience in supplier engagement and sustainability-driven material development

About the Company

Sandisk relentlessly innovates to deliver solutions that enable today’s needs and tomorrow’s next big ideas, specializing in Flash and advanced memory technologies.