Senior Packaging Engineer, Material Engineering at Sandisk - ScoutJobs - The AI-curated global job board
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Sandisk
Posted 7 hours ago

Senior Packaging Engineer, Material Engineering

SandiskSenior Packaging Engineer, Material Engineering

Requirements

Master's or PhD in Materials Science or related field, Minimum 5 years semiconductor packaging experience, Knowledge of material characterization and mechanics, Understanding of polymers, adhesives, and substrates, Familiarity with ASTM and JEDEC standards

Skills

Materials ScienceSemiconductorFailure Analysis

About the role

Responsibilities

  • Drive advancement in packaging materials by addressing design and process challenges to support next-generation requirements like smaller form factors and higher interconnect density.
  • Lead the evaluation, development, and qualification of advanced packaging materials for product development and high-volume manufacturing.
  • Perform material characterization, lab testing, and design of experiments (DOE) to simulate manufacturing processes and use-condition failures.
  • Analyze thermal, mechanical, and environmental performance to ensure materials meet reliability and performance targets.
  • Interface with cross-functional teams including package design, reliability, failure analysis, and assembly R&D.
  • Collaborate with suppliers to develop, optimize, and qualify materials for successful production integration.

Requirements

  • Master's or PhD in Materials Science or a related engineering field.
  • Minimum 5 years of experience in semiconductor packaging, materials engineering, or related industries.
  • Strong background in material characterization and material mechanics with an emphasis on failure analysis and DOE.
  • Deep understanding of packaging material systems, including polymers, adhesives, laminates, EMC, and substrates.
  • Familiarity with industry standards and reliability test methods such as ASTM and JEDEC.
  • Proven ability to work effectively in cross-functional and global team environments.

Preferred Qualifications

  • Working knowledge of various material testing and characterization instruments.
  • Understanding of semiconductor packaging processes such as molding, wire-bonding, die attach, flip chip, and SMT.
  • Experience in supplier engagement and sustainability-driven material development.

About the Company

Sandisk relentlessly innovates to deliver solutions that enable today’s needs and tomorrow’s next big ideas. With a rich history of groundbreaking innovations in Flash and advanced memory technologies, our solutions are the beating heart of the digital world. We combine powerhouse manufacturing capabilities with an industry-leading portfolio recognized globally for innovation, performance, and quality.

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Senior Packaging Engineer, Material Engineering

Sandisk · Batu Kawan

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