
Posted 7 hours ago
Senior Packaging Engineer, Material Engineering
SandiskSenior Packaging Engineer, Material Engineering
Requirements
Master's or PhD in Materials Science or related field, Minimum 5 years semiconductor packaging experience, Knowledge of material characterization and mechanics, Understanding of polymers, adhesives, and substrates, Familiarity with ASTM and JEDEC standards
Skills
Materials ScienceSemiconductorFailure Analysis
About the role
Responsibilities
- Drive advancement in packaging materials by addressing design and process challenges to support next-generation requirements like smaller form factors and higher interconnect density.
- Lead the evaluation, development, and qualification of advanced packaging materials for product development and high-volume manufacturing.
- Perform material characterization, lab testing, and design of experiments (DOE) to simulate manufacturing processes and use-condition failures.
- Analyze thermal, mechanical, and environmental performance to ensure materials meet reliability and performance targets.
- Interface with cross-functional teams including package design, reliability, failure analysis, and assembly R&D.
- Collaborate with suppliers to develop, optimize, and qualify materials for successful production integration.
Requirements
- Master's or PhD in Materials Science or a related engineering field.
- Minimum 5 years of experience in semiconductor packaging, materials engineering, or related industries.
- Strong background in material characterization and material mechanics with an emphasis on failure analysis and DOE.
- Deep understanding of packaging material systems, including polymers, adhesives, laminates, EMC, and substrates.
- Familiarity with industry standards and reliability test methods such as ASTM and JEDEC.
- Proven ability to work effectively in cross-functional and global team environments.
Preferred Qualifications
- Working knowledge of various material testing and characterization instruments.
- Understanding of semiconductor packaging processes such as molding, wire-bonding, die attach, flip chip, and SMT.
- Experience in supplier engagement and sustainability-driven material development.
About the Company
Sandisk relentlessly innovates to deliver solutions that enable today’s needs and tomorrow’s next big ideas. With a rich history of groundbreaking innovations in Flash and advanced memory technologies, our solutions are the beating heart of the digital world. We combine powerhouse manufacturing capabilities with an industry-leading portfolio recognized globally for innovation, performance, and quality.
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Sandisk · Batu Kawan
