Senior Packaging Engineer

About the Company

Arago is an AI and computer hardware company whose mission is to drive the course of history forward by accelerating breakthroughs at the intersection of AI and semiconductors. Founded in 2024, the company brings together a lean team of engineers and scientists from the world’s top companies and research labs.

Responsibilities

• Design packaging solutions spanning from initial drawings and simulations to DFM
• Identify, vet, and manage external sub-contractors
• Collaborate cross-functionally with IC design, optical, and PCB teams to align packaging specifications across domains
• Lead the chip industrialization process, ensuring high yield and Cpk
• Conduct thorough failure analysis and debugging
• Lead IC packaging initiatives from conceptualization and design to manufacturing process selection
• Establish the necessary supply chain and oversee NPI and ramp-up phases

Requirements

• Master's degree in Electrical Engineering or Integrated Circuits Design
• 5+ years of experience in the semiconductor and photonic packaging industry
• Proficiency in heterogeneous integration and packaging processes (wafer dicing, Cu pillars, flip-chip, RDL, encapsulation, die attach, bonding techniques, wirebonding, 2.5D/3D integration)
• Expertise in photonic and optoelectronic packaging and micro-scale optical alignment
• Experience with InP, GaAs, and other non-Si semiconductors
• Proficiency in thermal, mechanical, and EM simulations
• Experience with Cadence Allegro Package Designer, Altium, Cadence Virtuoso, Cadence Sigrity, ANSYS Mechanical, HFSS, and SIwave
• Proficient English

Preferred Qualifications

• Understanding of packaging industrialization, production flows, and high-yield manufacturing
• Experience with failure analysis and Six Sigma methodology
• Proficiency in French