Senior Optical Packaging Process Engineer

Responsibilities

• Develop, validate, and optimize active alignment processes for high-precision optical components
• Lead process development and qualification for optical module packaging
• Support NPI efforts including DFM, DFR, and transition to production
• Design and execute experiments to optimize optical coupling efficiency, mechanical tolerances, and thermal performance
• Drive root cause analysis of yield and reliability issues
• Develop process documentation such as PFMEAs, control plans, and work instructions
• Collaborate with external vendors and internal stakeholders on materials and automation solutions
• Participate in equipment selection, installation, and qualification

Requirements

• Master’s Degree or above in Engineering, Physics, or Material Science
• 10+ years of experience in semiconductor PIC packaging design and multi-chip assemblies
• 5+ years of experience with optical fibers and optical measurements
• 5+ years of experience with advanced semiconductor packaging OSAT or EOL vendors
• 5+ years of experience with FAU or optical connector to chip attachment
• Experience with fiber attach tooling and optical data analysis
• Experience with FA and 8D failure resolution techniques
• Experience developing metrics for yield and quality management

About the Company

PsiQuantum's mission is to build the first useful quantum computers—machines capable of delivering the breakthroughs the field has long promised. Our architecture is based on silicon photonics, leveraging advanced semiconductor manufacturing to build million-qubit, fault-tolerant quantum systems.