Senior Optical Packaging & Assembly Engineer

Responsibilities

• Develop an optical package and fibre-to-chip alignment scheme for high accuracy and scalable assembly
• Develop packaging prototypes and scalable fibre-to-chip packaging flows and processes
• Review packaging design BOMs and work with supply chain for part procurement
• Transfer and scale packaging designs and processes with internal teams and external vendors
• Source required materials and provide feedback on evolving requirements
• Partner with external partners to develop advanced opto-electronic packaging solutions

Requirements

• Master’s Degree or above in Optical Engineering, Physics or equivalent
• 3+ years of experience in PIC packaging design and qualification
• 5+ years of experience with optical fibers and optical measurements
• 3+ years of experience with FAU or optical connector to chip attachment
• Experience with optical data analysis

About the Company

PsiQuantum's mission is to build the first useful quantum computers—machines capable of delivering the breakthroughs the field has long promised. Our architecture is based on silicon photonics, leveraging advanced semiconductor manufacturing to build million-qubit, fault-tolerant quantum systems.