Senior Maintenance Engineer (Wire Bond)

Responsibilities

• Drive and improve equipment performance metrics including OEE, MTBC, and UDT
• Lead troubleshooting and root cause analysis for equipment-related issues
• Plan and optimize preventive maintenance strategies and schedules
• Monitor equipment performance trends and drive improvement initiatives
• Collaborate with production, process, and vendors to implement effective solutions
• Coach and guide technicians on technical problem-solving and best practices

Requirements

• Bachelor’s Degree in Engineering (Mechanical, Electrical, Mechatronics, or Manufacturing)
• Minimum 6 years of experience in semiconductor equipment maintenance
• Strong troubleshooting and root cause analysis capability
• Solid understanding of equipment performance metrics (OEE, MTBC, downtime analysis)
• Good leadership and cross-functional communication skills

Preferred Qualifications

• Experience with wire bonding equipment (e.g., Shinkawa UTCx000 series, K&S Iconn)
• Familiarity with structured problem-solving methodologies
• Experience in equipment reliability and optimization projects
• Hands-on experience in equipment troubleshooting and validation
• Knowledge of automation, vision systems, and predictive maintenance approaches

About the Company

Renesas is an embedded semiconductor solution provider driven by its purpose "To Make Our Lives Easier." As a leading expert in embedded processing, Renesas provides scalable and comprehensive semiconductor solutions for the automotive, industrial, infrastructure, and IoT industries. With a diverse team of over 21,000 professionals globally, we design and develop sustainable, power-efficient solutions that help people and communities thrive.