Senior IC Packaging Designer

Responsibilities

• Design and develop RFIC packages and substrates optimized for high-frequency performance
• Create package layouts, bond diagrams, and substrate routing using semiconductor packaging EDA tools
• Work with signal integrity, EM, and thermal simulation teams to validate package performance
• Generate package documentation, fabrication drawings, and assembly specifications
• Participate in design reviews, prototype builds, and failure analysis
• Collaborate with RFIC designers to co-optimize chip and package performance
• Support package integration with PCB design teams
• Coordinate with fabrication and assembly partners

Requirements

• Bachelor’s degree in Electrical Engineering, Computer Engineering, Computer Science, or a related discipline
• 3-5 years of experience designing advanced RFIC semiconductor packages up to 50GHz
• Proficiency with tools such as Cadence Allegro APD/SiP or Mentor Xpedition
• Strong foundation in electrical, thermal, materials, or mechanical engineering principles
• Ability to work full-time onsite in Atlanta, GA

Preferred Qualifications

• Familiarity with signal and power integrity analysis tools like HFSS, Q3D, or PowerSI
• Knowledge of substrate manufacturing processes and design verification tools like CAM350, Valor, or Calibre
• Experience with RFIC or 5G packaging design
• Scripting skills in Python, TCL, Perl, or shell
• Ability to build 3-D models using Ansys Electronics Desktop and run thermal simulations with Icepak

Benefits

• Competitive Salary and Equity Package
• Comprehensive Health, Dental, and Vision Insurance
• 401(k) Retirement Plan
• Paid Time Off (PTO) and Sick Leave