Senior Equipment Engineer

Responsibilities

• Own the performance, reliability, and lifecycle management of wafer taping and mounting equipment, including installation, commissioning, and preventive maintenance
• Lead escalation-level troubleshooting across electromechanical, pneumatic, robotic, motion-control, vacuum, and automation systems
• Drive root-cause analysis for equipment failures, lamination defects, yield loss, and scrap events
• Partner with Process Engineering to optimize equipment configurations for taping, lamination, backgrinding, and dicing
• Improve equipment performance through data-driven reliability engineering (MTBF/MTTR) and predictive maintenance
• Lead continuous improvement initiatives including hardware modifications and software upgrades
• Manage OEM/vendor interactions, spare parts strategy, and technical documentation

Requirements

• Bachelor’s degree in Mechanical Engineering, Electrical Engineering, Mechatronics, or related field
• 5+ years of semiconductor equipment engineering experience in Back-End Assembly or Advanced Packaging
• Hands-on experience troubleshooting wafer tape-frame equipment (e.g., Takatori, Disco, Adwill-Lintec, Tazmo)
• Strong knowledge of pneumatics, servo systems, robotics, wafer handling, and industrial automation
• Experience working in ISO 5/6 cleanroom environments

Preferred Qualifications

• Experience with temporary bond/debond, wafer backgrind, or UV irradiation processes

About the Company

Black Semiconductor is transforming the semiconductor industry by harnessing the physical properties of graphene to combine electronic computing with photonic communication, creating powerful and energy-efficient networks.