Senior Engineer, Semi Packaging Engineering

Responsibilities

• Develop advanced integrated circuit (IC) packaging solutions, including design, material selection, and qualification
• Perform component or system-level mechanical stress and thermal simulations
• Manage projects through design iterations, substrate layout, prototype assembly, and qualification
• Document manufacturing process flows and control plans for external suppliers
• Collaborate with quality and reliability groups to establish reliability criteria and qualification plans
• Communicate complex engineering concepts effectively to global cross-functional teams

Requirements

• Master’s degree in Mechanical, Materials, Electrical, or Robotics Engineering (or a related field)
• 2 years of experience in semiconductor packaging or a related occupation
• Expertise in 3D CAD tools (SolidWorks) and FEA software (ANSYS)
• Experience in IC package design, optimization, and manufacturing
• Proficiency in IC package reliability requirements and failure analysis techniques
• Knowledge of FMEA, SPC, DOE, and PCN
• Proficiency in AutoCAD

About the Company

Analog Devices, Inc. (ADI) is a global semiconductor leader that bridges the physical and digital worlds to enable breakthroughs at the Intelligent Edge. ADI combines analog, digital, and software technologies into solutions that drive advancements in digitized factories, mobility, digital healthcare, and climate change solutions.