Senior Engineer, Semi Packaging Engineering

Responsibilities

• Develop and qualify competitive Wafer-Level Packaging (WLP) solutions to support new product integration
• Partner with Business Units, Designers, and Marketing to define requirements for new products
• Manage product-package development at subcontractors and OSATs
• Work closely with Quality and Reliability groups to ensure design-for-manufacturability and design-for-reliability
• Review and manage process changes at subcontractors that impact product performance
• Monitor production metrics and process capability data (Cpk) at subcontractor sites

Requirements

• Ph.D. or Master’s degree in Mechanical, Material, or Electrical engineering
• Relevant experience in wafer-level package development, process, equipment, qualification, and manufacturing implementation
• Strong knowledge of package reliability requirements and failure analysis techniques
• Understanding of assembly process issues

Preferred Qualifications

• Knowledge of Ansys or Flotherm

About the Company

Analog Devices (ADI) is a global semiconductor leader that bridges the physical and digital worlds to enable breakthroughs at the Intelligent Edge. For more than 55 years, ADI has been inventing breakthrough technologies that transform lives in fields ranging from autonomous vehicles and robotics to healthcare and energy.