Senior Engineer, Semi Packaging Engineering

Responsibilities

• Lead new product package development from design through qualification and production release
• Collaborate with design teams to understand requirements and influence package-related design decisions
• Work closely with overseas assembly subcontractors (OSATs) for package development and engineering activities
• Partner with reliability, business units, and supply chain management teams for engineering support
• Manage projects to ensure on-time delivery of development milestones
• Select package bill of materials (BOM) based on mechanical, thermal, and electrical properties
• Develop package design rules, specifications, models, and drawings
• Execute process development including FMEA, DOE, and process change notifications (PCN)

Requirements

• Master's degree in Mechanical, Materials, Chemical, Applied Physics, or Electrical Engineering
• 1-5 years of industrial experience in a related field
• Knowledge of various packaging technologies, process flows, and manufacturing implementation
• Understanding of IC package reliability requirements and failure analysis techniques
• Experience with FMEA and DOE

Preferred Qualifications

• Experience in finite element analysis (thermal, stress, and electrical)

About the Company

Analog Devices, Inc. (ADI) is a global semiconductor leader that bridges the physical and digital worlds to enable breakthroughs at the Intelligent Edge. ADI combines analog, digital, and software technologies into solutions that drive advancements in digitized factories, mobility, digital healthcare, and climate change solutions.