Senior Engineer, Packaging Engineering

Responsibilities

• Lead SiP (System In Package) product development from concept design and qualification to mass production
• Collaborate with global functional teams to review design drawings and propose design options
• Perform DFx analysis, characterization builds, and review mechanical and electrical simulations
• Execute package qualification plans and investigate reliability failures
• Monitor assembly and test yield and drive yield improvement initiatives
• Manage the transition of new products and technologies from low volume to high volume production
• Ensure FMEA, SOD, Control Plan, and SPC are ready prior to mass production

Requirements

• Master’s degree in Material Science, Polymer Science, Mechanical Engineering, or related engineering discipline
• Or Bachelor’s degree with minimum 2 years of relevant work experience
• Exceptional problem-solving skills with expertise in experimental design and statistical analysis
• Excellent communication skills for global team collaboration

Preferred Qualifications

• Proficient understanding of semiconductor SiP assembly domains (DP, DA, WB, Mold, and backend processes)
• Knowledge of packaging materials and failure analysis
• Experience with board level reliability or Finite Element Analysis (FEA)

About the Company

Sandisk delivers innovative Flash and advanced memory technologies that power the digital world. Recognized by the World Economic Forum as a Global Lighthouse Network member, Sandisk focuses on high-performance, quality, and sustainable manufacturing solutions.