Senior Engineer, Packaging Engineering

Responsibilities

• Lead SiP (System In Package) product development from concept design and qualification through to mass production.
• Collaborate with global functional teams in the US, India, China, and Taiwan to review design feasibility and propose optimized options.
• Perform comprehensive DFx (Design for x) analysis, including product performance, quality, cost, and manufacturability.
• Execute package qualification plans, monitor reliability status, and investigate/close failures.
• Manage the transition of new products from low volume to high volume production, ensuring yield and quality goals are met.
• Drive yield improvement and manage excursions during assembly and test phases.
• Lead new technology transitions involving new wafer technology, processes, or materials.

Requirements

• Master's degree in Material Science, Polymer Science, Mechanical Engineering, or a related engineering discipline.
• Bachelor's degree with a minimum of 2 years of relevant professional experience.
• Exceptional problem-solving skills with expertise in experimental design and statistical analysis.
• Excellent communication skills for effective collaboration with international teams.

Preferred Qualifications

• Proficient understanding of semiconductor SiP assembly domains (DP, DA, WB, Mold, and backend processes).
• Deep knowledge of packaging materials and failure analysis techniques.
• Experience with board level reliability and Finite Element Analysis (FEA).
• Ability to work effectively under high-pressure situations and maintain composure during uncertainty.

About the Company

Sandisk relentlessly innovates to deliver advanced memory technologies and Flash solutions that power the digital world. With a global reach and industry-leading manufacturing capabilities, we provide the essential hardware that enables businesses and individuals to push the boundaries of possibility.