Senior Engineer, APTD Package Health

Responsibilities

• Develop and implement DFT strategies for advanced packaging
• Conduct simulations for mechanical, thermal, and electrical performance
• Perform electrical and mechanical characterization of packages
• Analyze test and field data to identify early indicators of package degradation
• Collaborate with data scientists to build predictive models for package health
• Support root cause analysis and corrective actions for reliability issues

Requirements

• Bachelor’s or Master’s degree in Electrical Engineering, Materials Science, or a related field
• 2+ years of experience in the semiconductor industry, preferably in packaging, test, or reliability engineering
• Hands-on experience with simulation tools and test equipment for package characterization or failure analysis
• Proficiency in statistics, data analysis, and scripting (e.g., Python, MATLAB, JMP)
• Strong understanding of semiconductor packaging processes, material interactions, and properties
• Knowledge of DRAM or ASIC product testing, test architecture, and packaging fail modes

Preferred Qualifications

• Experience with AI/ML tools or statistical modeling
• Familiarity with JEDEC or other industry reliability standards
• Strong problem-solving and technical documentation skills

About the Company

Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence. We deliver a rich portfolio of high-performance DRAM, NAND, and NOR memory and storage products through our Micron® and Crucial® brands, fueling the data economy and enabling advances in artificial intelligence and 5G.