Senior ASIC Package Design Engineer

Responsibilities

• Define ASIC package architecture for FC-BGA and MCM solutions, including substrate stack-up, ball-map strategy, power delivery, signal breakout, and mechanical constraints
• Lead package-level trade studies across cost, performance, power integrity (PI), signal integrity (SI), thermal, manufacturability, and reliability
• Establish package design standards, methodologies, and best practices
• Drive detailed design of FC-BGA packages for high-pin-count ASICs with high-speed SerDes, dense power grids, and RF signal content
• Define and review substrate stack-ups, via strategies, impedance control, escape routing, and reference plane planning
• Partner with silicon, RF, and systems teams to co-optimize die floorplans and package interfaces
• Support package-level SI/PI strategy, including high-speed digital interfaces, power delivery network (PDN) design, and decoupling strategy
• Lead thermal architecture at the package level, including lid selection, TIMs, heat-spreaders, and mechanical interfaces to system cooling
• Drive material selection, substrate technology choices, and assembly process optimization

Requirements

• Bachelor’s degree in Packaging Engineering, Mechanical Engineering, Electrical Engineering, or a related field
• 5+ years of experience in ASIC package design, with deep expertise in FC-BGA
• Proven experience delivering high-pin-count, high-performance ASIC packages into production
• Strong understanding of substrate technologies and materials, SI/PI fundamentals, and thermal management
• Proficiency in SI/PI and EM simulation tools such as SIWave, HFSS, and ADS
• Experience working directly with OSATs and substrate vendors
• Knowledge of packaging qualification and test methodologies

Preferred Qualifications

• Experience with MCM or heterogeneous integration (chiplets, interposers, advanced laminates)
• Background in high-speed digital or mixed-signal SoCs
• Familiarity with aerospace, space, or high-reliability electronics

About the Company

K2 is building the largest and highest-power satellites ever flown, unlocking performance levels previously out of reach across every orbit. Backed by leading investors, K2 is mass-producing high-power satellite platforms for missions from LEO to deep space.