Rack Level HW Technical Lead (HW TPM)

Responsibilities

• Lead core support teams and drive overall program execution from development through the production lifecycle
• Kick off programs by defining dependencies, expectations, schedules, critical paths, and design review processes
• Track progress across hardware and software workstreams, prioritizing issues and driving them to timely closure
• Provide clear communication regarding issue status to customers and internal executive management teams
• Organize and lead technical discussions and engagements with global engineering teams
• Exhibit horizontal leadership across functional teams including Hardware, Software, Operations, Quality, and Sales
• Act as the sustaining technical contact window to provide post-production support and drive closure on quality issues
• Build close working relationships with customer development teams to assist in brainstorming technical solutions

Requirements

• 12+ years of experience in the high-tech electronics or semiconductor industry
• Proven expertise in program or project management, specifically with strategic customers
• Strong technical background with experience working within the OEM and ODM ecosystem
• Excellent communication, organizational, and horizontal leadership skills
• Bachelor's degree in Computer Science, Electrical/Electronics Engineering, or a related field

Preferred Qualifications

• Master's degree in Engineering or Information Management
• PhD in a relevant engineering field

About the Company

Qualcomm Cloud System Hardware Engineering team develops cutting-edge rack-level AI inference solutions for next-generation liquid-cooled data centers. We hire the brightest minds to contribute to world-changing innovations and breakthrough technologies.