Quantum Advanced Packaging Engineer

About the Company

QuantWare is building the world’s most powerful quantum processors to solve humanity's greatest challenges using unique VIO™ technology. We are paving the way for hyper-scale quantum computers that will change the world.

Responsibilities

• Drive R&D activities from early concept through prototyping to manufacturable processes
• Contribute hands-on to new packaging and assembly techniques using novel fabrication methods
• Lead, mentor, and inspire development of advanced packaging techniques for quantum hardware
• Collaborate with external partners and vendors to manage outsourced activities
• Allocate resources and time strategically to align priorities with company objectives
• Foster a culture of innovation and accountability within a scale-up environment

Requirements

• Master’s degree or higher in physics, electronics, materials science, or a related field
• 4+ years of experience in hardware R&D, ideally in semiconductor packaging development
• Proven ability to deliver solutions to complex technical challenges
• Strong communication skills for engaging both engineers and business stakeholders
• Experience leading R&D activities in a relevant field

Preferred Qualifications

• Experience with semiconductor processing and chip integration
• Experience with flip-chip and advanced packaging techniques
• Knowledge of packaging simulation tools, thermal management, and mechanical stress
• Experience building scalable processes in a startup or scale-up environment