封装设备工程师

Responsibilities

• Manage and ensure the stable operation of equipment in the back-end processes of module packaging
• Lead and manage a team of technicians, including daily work scheduling and task assignment
• Drive projects focused on potential efficiency improvements and cost reduction
• Implement new technologies for equipment upgrades and process improvements
• Plan and execute preventive maintenance and tool calibration schedules
• Monitor and improve key performance metrics such as OEE, MTBA, and MTBF
• Maintain, modify, and improve production equipment and tools to increase utilization and productivity

Requirements

• Bachelor's degree in Engineering, Physical Sciences, or a related field
• 4+ years of Manufacturing Engineering experience (or equivalent advanced degree with less experience)
• Proficiency in English and Microsoft Office software
• Strong knowledge of quality control tools
• Proven ability to work independently and deliver professional reports/presentations
• Strong organizational and logical thinking skills with a collaborative mindset

Preferred Qualifications

• 10+ years of equipment control experience within the electronics industry
• Hands-on repair experience with laser, cutting, or sputtering equipment
• Previous experience in team management or leadership roles