PWB Designer, Senior

Responsibilities

• Provide high-performance PWB design solutions for Mobile, Modem, and IoT products.
• Perform placement and routing activities using PWB CAD software to meet mechanical and electrical constraints.
• Execute complex designs including high-density digital designs (24-34 layers), RF, analog, and high-speed digital circuits (DDR, HDMI, PCIe, etc.).
• Manage electronic file transfers with mechanical and electrical engineers to ensure compliance with fit, form, function, and signal integrity.
• Create fabrication and assembly drawings and collaborate with internal teams and external suppliers to support production.
• Lead projects by directing and interfacing with outside consultants and resolving design issues with vendors.
• Conduct Design for Manufacture (DFM) analysis and propose design trade-offs to engineering teams.

Requirements

• Associate's degree in Electrical Engineering, Computer Science, Mathematics, or a related field with 5+ years of PCB layout experience.
• Alternatively, a High School diploma with 7+ years of relevant PCB layout experience.
• Proficiency in Mentor Xpedition, Mentor PADS, or Cadence Allegro.
• Extensive experience in high-density electronics packaging and high-layer count designs.
• Proven experience with DFM analysis using Valor or CAM350 tools.
• Strong understanding of RF, analog, and high-speed digital circuit design principles.

Preferred Qualifications

• Experience with micro-vias (stacked), sequential lamination stack-ups, and fine-pitch design rules (.5mm and smaller).
• Experience working with on-board EMI shielding cans.
• Familiarity with IDF/EMN file exchange processes between mechanical and hardware teams.
• Experience with ATE platforms such as 93K, uFlex, or iFlex.

About the Company

Qualcomm is a global leader in wireless technology, developing breakthrough innovations that power the world's most advanced mobile, modem, and IoT products. We foster a supportive, inclusive culture where the brightest minds collaborate to solve the most complex engineering challenges.