Process Integration Engineer

Responsibilities

• Partner with cross-functional teams and suppliers to develop innovative advanced packaging technologies
• Deliver reliable, cost-efficient packaging solutions on schedule with consistent performance
• Define project timelines, validation strategies, and qualification plans for new technologies
• Drive seamless transition from development through qualification into high-volume manufacturing
• Champion safety, compliance, and continuous improvement while contributing to technology roadmaps

Requirements

• 3+ years of professional experience in the semiconductor industry
• MS or PhD in Electrical Engineering, Materials Science, Mechanical Engineering, Physics, Chemistry, or a closely related field
• Professional experience in process integration, process development, or advanced packaging within an R&D environment

Preferred Qualifications

• End-to-end ownership of integration solutions from technology definition through high-volume manufacturing transfer
• Deep expertise in advanced packaging and interconnect technologies, including 2.5D/3DIC, wafer-level, or fan-out packaging
• Practical experience with interconnect methods such as wirebond, microbump, and/or hybrid bonding
• Strong semiconductor technology background with experience in memory (DRAM, NAND) and/or logic devices
• Proven strength in process integration problem-solving using DoE and data-driven decision making

Benefits

• Choice of medical, dental, and vision plans
• Income protection programs for illness or injury
• Paid family leave
• Robust paid time-off program and paid holidays

About the Company

Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.