Process Engineer

Responsibilities

• Develop, optimize, and sustain die bond and wire bond processes to meet quality, yield, and reliability requirements
• Perform process troubleshooting and root cause analysis for yield loss, defects, and equipment issues
• Support new product introduction (NPI), process qualification, and transfer to mass production
• Establish and maintain process parameters, work instructions, and control plans
• Analyze process data using statistical methods such as SPC, CPK, and trend analysis
• Collaborate with cross-functional teams including Production, Quality, Equipment, and R&D
• Drive continuous improvement activities for cost, yield, cycle time, and reliability

Requirements

• Bachelor’s degree in Engineering (Materials, Mechanical, or related field)
• Minimum 2 years of experience in semiconductor back-end assembly
• Strong knowledge of die bonding and wire bonding processes
• Familiarity with back-end materials such as leadframes, substrates, adhesives, and bonding wires
• Proficiency in statistical methods and data analysis

Preferred Qualifications

• Experience with QFN or similar semiconductor packages
• Knowledge of yield improvement, reliability testing, and failure analysis
• Exposure to automation, equipment setup, and process optimization
• Knowledge of SMT processes such as Solder Print, Die Attach, and Clip Bond Attach
• Experience with process characterization and Design of Experiments (DOE)

About the Company

Renesas is an embedded semiconductor solution provider driven by its purpose "To Make Our Lives Easier." As a leading expert in embedded processing, Renesas provides scalable and comprehensive semiconductor solutions for the automotive, industrial, infrastructure, and IoT industries. With a diverse team of over 21,000 professionals globally, we design and develop sustainable, power-efficient solutions that help people and communities thrive.