Posted 6 hours ago
Process Engineer Intern (Wire Bonding)
NXP Semiconductors
Requirements
Understanding of Plasma cleaning principle, Bachelor's or Master's in Material/Science/Electronic Engineering, Available at least 3 days/week, English communication skills, MS Office or Programming skills
Skills
Material Science
About the role
Responsibilities
- Work closely with operations and maintenance teams to ensure smooth production processes
- Assist with action confirmations using system monitors
- Collaborate with engineers to drive yield improvements through the study of stable plasma cleaning as a leading indicator
Requirements
- Currently pursuing a Bachelor's or Master's degree in Material Science, Electronic Engineering, or a related field
- Understanding of plasma cleaning principles for wire bonding integrity (chip die pad, wire type, and lead-post structures)
- Ability to work onsite at least 3 days per week
- Good verbal and written English communication skills
- Proficiency in MS Office or programming skills
- Self-motivated, results-oriented, and proactive attitude with an eagerness to learn
About the Company
NXP Semiconductors enables a smarter, safer, and more sustainable world through innovation. As a global leader in secure connectivity solutions for embedded applications, NXP pushes boundaries in the automotive, industrial & IoT, mobile, and communication infrastructure markets.
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Get started — it's freeProcess Engineer Intern (Wire Bonding)
NXP Semiconductors · Kaohsiung
