Process Engineer

Responsibilities

• Partner with RF Engineering to identify suitable materials and assembly technologies
• Evaluate and optimize die attach methods including silver epoxy, silver sinter, and eutectic attach
• Develop and optimize gold wire bonding processes (ball and wedge bonding)
• Define, document, and control manufacturing processes, SOPs, and control plans
• Implement SPC, Cp/Cpk analysis, and yield monitoring
• Lead root cause investigations using 8D, DMAIC, or FMEA methodologies
• Drive DFM/DFA reviews and support New Product Introduction (NPI)

Requirements

• Degree in Engineering, Materials Science, Physics, or a related discipline
• Experience in semiconductor or RF module assembly processes
• Hands-on experience with silver epoxy, silver sintering, eutectic die attach, or gold wire bonding
• Understanding of materials behavior, intermetallic formation, and thermal management
• Experience with process validation and statistical analysis tools
• Strong problem-solving capability in a manufacturing environment

Preferred Qualifications

• Experience in high-precision automotive electronics or power electronics
• Experience with equipment specification, procurement, and commissioning
• Knowledge of RF packaging requirements and JEDEC standards
• Experience with thermomechanical modelling and material reliability testing
• Familiarity with IATF 16949 or ISO 9001 standards

About the Company

Filtronic PLC is a world leader in the design and manufacture of customised microwave and millimetre wave electronics used within satellite, defence, and terrestrial telecommunications applications.