Process Engineer CMP

Responsibilities

• Lead the development and implementation of CMP processes tailored to 2D materials (e.g., graphene) and novel device architectures
• Evaluate and define process specifications and collaborate with vendors to select and qualify CMP tools
• Own fab startup activities including tool installation, acceptance testing, recipe validation, and ramp-up
• Establish and maintain Process of Record (POR) for critical clean steps and define ramp-to-production protocols
• Implement and manage SPC systems and drive continuous improvement via data-driven methodologies

Requirements

• Minimum 5 years of hands-on experience in semiconductor process engineering with a focus on CMP
• Deep understanding of contamination control, surface preparation, and CMP challenges
• Proven experience working with CMP consumables, chemicals, process, and hardware
• Hands-on experience with 300mm plating tools (e.g., AMAT, Ebara)
• Experience in fab startup, pilot line development, or technology ramp-up environments

Preferred Qualifications

• Practical exposure to 2D material preparation and integration

About the Company

Black Semiconductor is a semiconductor company focused on next-generation materials and device architectures, fostering a human-centric culture that prioritizes flexibility and professional growth.