Principal Process Engineer, Die Bonding

Responsibilities

• Develop, diagnose, and resolve various die bonding process technologies
• Coordinate and execute process, equipment, and material evaluation and optimization initiatives
• Lead continuous yield improvement and cost reduction activities
• Validate new process baselines, including new tools and materials for new product introduction
• Manage and audit material suppliers to achieve quality and risk management objectives
• Support SPC, FDC, RMS, and APC methodologies to ensure site-to-site portability
• Identify and resolve assembly process problems using failure analysis, FMEA, 8D, or SPC/FDC

Requirements

• BS degree in Engineering or a related field
• 8+ years of proven experience in semiconductor process engineering
• Solid engineering knowledge of semiconductor advanced packaging die stacking processes
• Proficiency in designing valid tests and Design of Experiments (DOE)
• Excellent data collection, organization, and analysis skills
• Strong oral and written communication skills with high attention to detail
• Ability to work independently, as a group leader, and as a collaborative contributor

Preferred Qualifications

• Master's or Doctorate degree in Engineering, Physics, or a related field
• Experience with Fusion Bonding, Hybrid Bonding, or Direct Bonding
• Experience with applications such as MEMS, Imager, Memory, or Heterogeneous Integration
• Previous bonding experience at a vendor, research institute, or semiconductor equipment supplier

Benefits

• Choice of medical, dental, and vision plans
• Income protection programs for illness or injury
• Paid family leave
• Robust paid time-off program and paid holidays

About the Company

Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence. Our Advanced Packaging Technology Development department drives the advancement of interconnects and packaging solutions that enable next-generation semiconductor products for the AI revolution.