Principal Power Electronics Packaging Engineer

About the Company

Helion is a fusion power company based in Everett, WA, with the mission to build the world's first fusion power plant, enabling a future with unlimited clean electricity. Since 2013, Helion has raised $1.5 billion to propel the development of fusion technology.

Responsibilities

• Lead development of next-generation thermal management and packaging architectures for high-current switching components
• Work across packaging geometry, materials selection, and cooling system design to push the performance ceiling of pulsed power switch assemblies
• Collaborate with internal teams and industry partners to accelerate development of packaging solutions
• Build test setups to validate thermal and electrical performance under realistic pulsed conditions and use that data to drive iteration

Requirements

• Hands-on experience with power electronics packaging for high-current or high-voltage applications
• Strong thermal engineering fundamentals with modeling and bench validation experience
• Experience with SCRs, diodes, or similar power semiconductors in demanding environments
• Proven experience translating research into tangible hardware and products

Benefits

• Medical, Dental, and Vision plans for employees and their families
• 31 Days of PTO (21 vacation days and 10 sick days)
• 10 Paid holidays, plus company-wide winter break
• Up to 5% employer 401(k) match
• Short term disability, long term disability, and life insurance
• Paid parental leave (up to 16 weeks)
• Annual wellness stipend