Principal Package Design Engineer

Responsibilities

• Lead the design, development, and qualification of advanced semiconductor packaging solutions, including Flip-chip, WLP/FOWLP, 2.5D/3D packaging, and SiP.
• Define package architecture based on electrical, thermal, mechanical, reliability, and cost requirements.
• Drive package technology selection and development for new product introductions.
• Collaborate with IC design, substrate, board, thermal, and manufacturing teams to ensure performance and compatibility.
• Oversee package layout reviews, stack-up definition, material selection, and interconnect strategy.
• Perform and guide simulations related to signal/power integrity, thermal performance, and mechanical stress.
• Develop assembly flows and process requirements for OSATs and manufacturing partners.
• Lead package qualification activities, including DOE planning, failure analysis, and reliability testing.
• Mentor junior engineers and provide technical leadership across packaging initiatives.

Requirements

• MSc or PhD in Electrical, Materials, Mechanical, or Chemical Engineering.
• 5+ years of experience in semiconductor packaging or advanced electronics packaging.
• Strong knowledge of advanced packaging technologies, materials, and assembly processes.
• Experience with package reliability testing and qualification standards.
• Deep understanding of thermal, mechanical, and electrical interactions in package design.
• Experience working with OSATs, substrate vendors, and semiconductor supply chains.
• Strong project leadership and cross-functional communication skills.

Preferred Qualifications

• Experience with power semiconductor devices (Si/SiC/GaN MOSFETS) and power modules.
• Hands-on experience with design and simulation tools such as Cadence Allegro, SolidWorks, ANSYS, or COMSOL.
• Knowledge of JEDEC and IPC standards.
• Experience in W2W, D2W, D2D 3D heterogeneous integration and chiplet-based packaging.

About the Company

Renesas Electronics is a global leader in microcontrollers, analog, power, and SoC products, delivering trusted embedded design innovation that shapes the way we live, work, and connect. We provide scalable and comprehensive semiconductor solutions for the automotive, industrial, infrastructure, and IoT industries.