Principal EUV Mask BEOL R&D Engineer

Responsibilities

• Lead R&D for EUV mask BEOL characterization, quality enablement, defect printability rules, and imaging performance
• Develop actinic inspection, automated defect classification, printability assessment, metrology, and defect repair processes
• Drive physics-based modeling and lithography simulation to correlate mask properties with wafer performance
• Define tool capability requirements, lead early supplier engagement, and guide technology selection
• Mentor engineers and transition developed technologies to BEOL process engineering teams

Requirements

• MS or PhD in Physics, Optics, Materials Science, or a related field
• Experience in EUV or High-NA EUV mask or wafer technology development
• Strong understanding of EUV lithography and mask-to-wafer correlation
• Hands-on experience with lithography simulation and mask pattern design
• Proven ability to lead sophisticated R&D programs and communicate across teams and suppliers

Preferred Qualifications

• Experience in actinic mask inspection, defect printability, or mask repair
• Background in BEOL mask process quality control or production qualification
• Experience defining advanced semiconductor tool requirements and roadmap strategy
• Familiarity with supplier engagement and early-phase tool development

Benefits

• Choice of medical, dental, and vision plans
• Income protection programs for illness or injury
• Paid family leave
• Robust paid time-off program and paid holidays

About the Company

Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence. Our Mask Technology Center (MTC) team is at the forefront of High-NA EUV innovation, working on the industry’s toughest lithography and mask challenges to define the future of DRAM manufacturing.