Principal Engineer

Responsibilities

• Lead the design and development of complex Application-Specific Integrated Circuits (ASICs) for High Bandwidth Memories (HBM) used in AI and high-performance computing.
• Establish and grow a premier analog/mixed-signal layout team to meet global HBM requirements.
• Manage project layout teams, including task organization, resource allocation, and logistics for multiple projects.
• Oversee the timely development of analog and custom layouts, ensuring optimization for performance, power, and area.
• Drive technical excellence in die design, high-speed interface principles, and off-chip signaling.
• Represent Micron in industry standards committees and stay informed on semiconductor developments.
• Manage team performance, including hiring, development, and retention.

Requirements

• 15+ years of experience in analog/custom layout using advanced CMOS processes.
• 4+ years of experience in team development and project leadership.
• Proven track record of leading multiple projects through successful tape-out.
• Expertise in Cadence VLE/VXL and Calibre DRC/LVS.
• Strong skills in layout, floor planning, and manual routing.
• BE or MTech in Electronic or VLSI Engineering.
• Excellent verbal and written communication skills with the ability to work in multi-site, multi-time zone environments.

About the Company

Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence. For more than 45 years, Micron has redefined innovation with the world’s most advanced memory and semiconductor technologies, enabling advances in artificial intelligence, 5G, and the global data economy.