Principal Engineer - Manufacturing Process/Electronic Assemblies

Responsibilities

• Define and industrialize end-to-end manufacturing processes for complex electronic products, including SMT, system assembly, test, and packaging
• Specify SMT processes and equipment requirements for high-density, high-complexity printed circuit board assemblies (PCBAs)
• Design and deploy assembly processes integrating main PCBAs, daughter boards, cabling, and mechanical chassis
• Develop automated or semi-automated manufacturing solutions to improve quality and ensure ergonomic operations
• Act as the technical manufacturing partner for Contract Manufacturers during NPI and full-scale production ramp-up
• Troubleshoot manufacturing issues, lead root-cause analysis, and implement continuous improvement initiatives
• Collaborate with Design, R&D, Quality, and Supply Chain teams to drive successful project outcomes

Requirements

• Engineering degree in Manufacturing, Industrial, Electronics, or a related field
• 10+ years of experience in manufacturing or process engineering for complex electronic assemblies
• Deep expertise in SMT industrialization and electro-mechanical system assembly processes
• Proven track record working with Contract Manufacturers during NPI and production phases
• Fluency in both French and English is mandatory

Preferred Qualifications

• Experience with optical connections
• German language skills
• Strong understanding of automation, quality assurance, and cost optimization techniques

Benefits

• Comprehensive range of health, wellness, and financial benefits
• Opportunities for professional growth within a global technology leader

About the Company

Synopsys drives the innovations that shape the way we live and connect. We lead in chip design, verification, and IP integration, empowering the creation of high-performance silicon chips and software content for the Era of Pervasive Intelligence.