Principal Engineer, HBM Design-Technology Enablement

Responsibilities

• Partner with Design, Technology Development, and Product teams to define and deliver HBM self-consistent design, technology, and packaging roadmaps
• Translate HBM scaling challenges, including power, performance, reliability, variability, and manufacturability, into technology and test vehicle requirements
• Participate in multi-functional technical reviews and forums related to HBM technology and build tradeoffs
• Act as a technical contributor and mentor within the HIG-HBM organization

Requirements

• Minimum of 10 years of experience with a BS/MS in Electrical Engineering or a related field
• Strong experience in HBM or DRAM design, technology enablement, and node-aware methodology
• Solid understanding of process-design interactions at advanced nodes
• Proven ability to deliver practical methodology solutions used by design teams
• Effective collaboration skills across Architecture, design, and technology organizations

Preferred Qualifications

• Prior experience in DEG, technology PE, or node development roles
• Familiarity with HBM architecture and system-level constraints
• Experience contributing to cross-site technical alignment

Benefits

• Choice of medical, dental, and vision plans
• Income protection programs for illness or injury
• Paid family leave
• Robust paid time-off program and paid holidays

About the Company

Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.