Principal ASIC Package Design Engineer

Responsibilities

• Own ASIC package architecture for FC-BGA and MCM solutions, including substrate stack-up, ball-map strategy, power delivery, and signal breakout
• Lead package-level trade studies across cost, performance, power integrity (PI), signal integrity (SI), thermal, and reliability
• Define long-term packaging roadmap aligned with future ASIC nodes and multi-die integration
• Drive detailed design of FC-BGA packages for high-pin-count ASICs with high-speed SerDes and dense power grids
• Partner with silicon, RF, and systems teams to co-optimize die floorplans and package interfaces
• Own package-level SI/PI strategy, including PDN design and decoupling strategy
• Lead thermal architecture at the package level, including lid selection, TIMs, and heat-spreaders
• Serve as the primary technical interface to substrate vendors, assembly houses, and OSATs

Requirements

• Bachelor’s degree in Packaging Engineering, Mechanical Engineering, Electrical Engineering, or a related field
• 10+ years of experience in ASIC package design with deep expertise in FC-BGA
• Proven experience delivering high-pin-count, high-performance ASIC packages into production
• Strong understanding of substrate technologies, SI/PI fundamentals, and thermal management
• Proficiency in SI/PI and EM simulation tools such as SIWave, HFSS, and ADS
• Experience working directly with OSATs and substrate vendors
• Knowledge of packaging qualification and test methodologies

Preferred Qualifications

• Experience with MCM or heterogeneous integration (chiplets, interposers)
• Background in high-speed digital or mixed-signal SoCs
• Familiarity with aerospace, space, or high-reliability electronics
• Experience defining packaging strategy from early architecture through volume ramp

About the Company

K2 is building the largest and highest-power satellites ever flown, unlocking performance levels previously out of reach across every orbit. Backed by $450M from leading investors, K2 is mass-producing high-power satellite platforms for missions from LEO to deep space.