Physical Design Lead

Responsibilities

• Own the Physical Design for one complete Chiplet on advanced technology nodes, preferably TSMC 2nm or 3nm.
• Work with external stakeholders including Architects, IP teams, and CAD/Methodology teams.
• Drive best PPA (Power, Performance, and Area) attainments and optimize latency on datapaths.
• Collaborate with package teams on power delivery and other technical interdependencies.
• Sign off the Chiplet for Tapeout from a Physical Design perspective.
• Monitor signoff functions such as Physical Verification and IREM.

Requirements

• 15+ years of experience in Physical Design handling full chip activities and signoff.
• Proven expertise in driving Full Chip Floorplan based on architecture and defining timing targets across PVTs.
• Experience with advanced technology nodes (TSMC 2nm/3nm preferred).
• Bachelor’s or Master’s degree in a related engineering discipline.
• Excellent communication, management, and presentation skills.
• Ability to collaborate effectively with senior architects and cross-functional teams across different geographies.

About the Company

AMD's mission is to build great products that accelerate next-generation computing experiences—from AI and data centers, to PCs, gaming, and embedded systems. Grounded in a culture of innovation and collaboration, we push the limits of innovation to solve the world’s most important challenges.