Physical Design Director

Responsibilities

• Lead end-to-end RTL-to-GDSII execution for complex SoC programs, including synthesis, floorplanning, placement, CTS, and routing
• Own timing, power, and physical signoff strategies, including STA, SI, and IR/EM analysis to ensure first-pass silicon success
• Drive PPA optimization through advanced routing methodologies, congestion management, and library strategies
• Establish and enforce DRC/LVS closure methodologies and streamline ECO flows to meet aggressive tapeout schedules
• Build, scale, and mentor high-performing physical design teams and technical leads
• Define and deploy automated design methodologies using TCL, Python, or Perl in collaboration with CAD teams
• Partner with RTL, DFT, packaging, and system teams to align design, testability, and manufacturability goals

Requirements

• B.Tech/M.Tech in Electrical/Electronics Engineering or a related field
• 15+ years of experience in physical design with a proven track record of successful SoC tapeouts
• Extensive experience with advanced process nodes (28nm down to 3nm)
• Deep expertise in full-chip physical design, including floorplanning, power planning, and clock architecture
• Strong command of STA, constraint development, and signoff closure (timing, SI, IR/EM)
• Proficiency in scripting languages such as TCL, Python, or Perl for design automation
• Excellent communication and stakeholder management skills for operating in global, cross-functional environments

About the Company

Analog Devices, Inc. (ADI) is a global semiconductor leader that bridges the physical and digital worlds to enable breakthroughs at the Intelligent Edge. Combining analog, digital, and software technologies, ADI drives advancements in digitized factories, mobility, digital healthcare, and climate change solutions. With over 24,000 employees globally, ADI is dedicated to helping innovators stay Ahead of What's Possible™.