Packaging Process Engineer – Microdisplay at Snap Inc - ScoutJobs - The AI-curated global job board
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Snap Inc
Posted 8 days ago

Packaging Process Engineer – Microdisplay

Snap IncPackaging Process Engineer – Microdisplay

Requirements

BS in Electrical, Materials, or Mechanical Engineering, 7+ years process or packaging engineering experience, Experience with automated production equipment, Experience in semiconductor or display final test, Proficiency in DOE and SPC, Ability to work in ISO 5 cleanroom

Skills

SemiconductorProcess Engineering

About the role

Responsibilities

  • Serve as the technical process owner for backend packaging and continuity testing tools, supporting advanced displays from prototyping through production.
  • Own and optimize backend packaging processes for LCOS advanced displays to ensure stable, high-yield output in high-volume manufacturing.
  • Act as the primary technical interface for equipment, materials, and manufacturing partners, overseeing tool qualification and issue resolution.
  • Develop and sustain assembly recipes, control plans, and SPC systems to drive continuous improvement in yield and reliability.
  • Lead structured problem solving using DOEs, FMEA, and root cause analysis for yield excursions and parametric drifts.
  • Partner with cross-functional teams to define capacity models and WIP/uptime strategies.

Requirements

  • BS in Electrical Engineering, Materials Science, Mechanical Engineering, or a related technical field.
  • 7+ years of experience as a process or packaging engineer in microfabrication fabs.
  • Direct experience designing and optimizing automated production equipment for semiconductors or displays.
  • Direct experience in final test for semiconductor or display packages.
  • Proven track record of improving yield and process stability through DOE and SPC.
  • Ability to work in an ISO 5 cleanroom environment.
  • Ability to travel internationally (up to ~10%) between the U.S., Taiwan, and supplier sites.

Preferred Qualifications

  • 10+ years of experience in process engineering and backend packaging.
  • Foundation in Six Sigma methodologies.
  • Experience with automated optical assembly and test equipment.
  • Experience developing and sustaining wire bonding processes for high-density LCOS packages.
  • Expertise in backend assembly processes including die attach, marking, and final packing.

Benefits

  • Comprehensive medical coverage.
  • Paid parental leave.
  • Emotional and mental health support programs.
  • Equity compensation (RSUs).

About the Company

Snap Inc. is a technology company that believes the camera presents the greatest opportunity to improve the way people live and communicate. Through products like Snapchat, Lens Studio, and Spectacles, Snap empowers people to express themselves and experience the world through augmented reality.

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Packaging Process Engineer – Microdisplay

Snap Inc · Chandler

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